TI

Tadashi Iida

HI Hitachi: 7 patents #5,859 of 28,497Top 25%
MH Mitsui High-Tec: 3 patents #34 of 174Top 20%
SU Subaru: 2 patents #413 of 1,436Top 30%
KC Kansai Paint Co.: 2 patents #263 of 822Top 35%
PA Panasonic: 2 patents #9,678 of 21,108Top 50%
TO Toyota: 1 patents #15,335 of 26,838Top 60%
Overall (All Time): #347,129 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10751782 Method for processing laminated material Akihiro Hashimoto, Masahiro Izumi 2020-08-25
9647518 Method for manufacturing laminated iron core Akihiro Hashimoto, Kiyomi Kawamura, Koichi Mitamura 2017-05-09
9641055 Method for manufacturing laminated iron core Akihiro Hashimoto, Kiyomi Kawamura, Koichi Mitamura 2017-05-02
8906465 Method for forming multilayer coating film Junya Ogawa, Koji Kanagawa, Shuichi Nakahara, Hiroyuki Nagano, Yoshizumi Matsuno +1 more 2014-12-09
8008393 Automobile water-based paint Yoshizumi Matsuno, Yasushi Nakao 2011-08-30
7169216 Electroless copper plating solution, electroless copper plating process and production process of circuit board Takeyuki Itabashi, Hiroshi Kanemoto, Haruo Akahoshi, Eiji Takai, Naoki Nishimura +1 more 2007-01-30
6989329 Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections Takeyuki Itabashi, Haruo Akahoshi, Eiji Takai, Naoki Nishimura, Yoshinori Ueda 2006-01-24
6900394 Electroless copper plating machine, and multi-layer printed wiring board Takeyuki Itabashi, Haruo Akahoshi, Yoshinori Ueda, Eiji Takai, Naoki Nishimura 2005-05-31
6831009 Wiring substrate and an electroless copper plating solution for providing interlayer connections Takeyuki Itabashi, Haruo Akahoshi, Eiji Takai, Naoki Nishimura, Yoshinori Ueda 2004-12-14
6805915 Electroless copper plating solution, electroless copper plating process and production process of circuit board Takeyuki Itabashi, Hiroshi Kanemoto, Haruo Akahoshi, Eiji Takai, Naoki Nishimura +1 more 2004-10-19
5930382 Wiring pattern inspecting method and system for carrying out the same Yoko Irie, Hideaki Doi, Yasuhiko Hara, Yasuhiro Fujishita, Yasuo Nakagawa +1 more 1999-07-27
5754621 X-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit board Yoko Suzuki, Hideaki Doi, Yasuhiko Hara, Koichi Karasaki 1998-05-19
5645364 Structure for joining plate elements Yasuo Hodozuka, Yoshikazu Yamaga, Satoshi Ueda, Yasuo Imaizumi 1997-07-08
5476210 Structure for joining plate elements and method for joining the same Yasuo Hodozuka, Yoshikazu Yamaga, Satoshi Ueda, Yasuo Imaizumi 1995-12-19