Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7789285 | Solder printing process to reduce void formation in a microvia | Cheng Siew Tay, Pek Chew Tan, Eng Hooi Yap | 2010-09-07 |
| 7642660 | Method and apparatus for reducing electrical interconnection fatigue | Cheng Siew Tay, Eng Huat Goh | 2010-01-05 |
| 7331503 | Solder printing process to reduce void formation in a microvia | Cheng Siew Tay, Pek Chew Tan, Eng Hooi Yap | 2008-02-19 |
| 7173342 | Method and apparatus for reducing electrical interconnection fatigue | Cheng Siew Tay, Eng Huat Goh | 2007-02-06 |