Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7789285 | Solder printing process to reduce void formation in a microvia | Cheng Siew Tay, Swee Kian Cheng, Eng Hooi Yap | 2010-09-07 | $9,640,000 |
| 7400040 | Thermal interface apparatus, systems, and methods | Eng Hooi Yap, Cheng Siew Tay | 2008-07-15 | $32,414,000 |
| 7331503 | Solder printing process to reduce void formation in a microvia | Cheng Siew Tay, Swee Kian Cheng, Eng Hooi Yap | 2008-02-19 | $15,849,000 |