Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7789285 | Solder printing process to reduce void formation in a microvia | Cheng Siew Tay, Swee Kian Cheng, Eng Hooi Yap | 2010-09-07 |
| 7400040 | Thermal interface apparatus, systems, and methods | Eng Hooi Yap, Cheng Siew Tay | 2008-07-15 |
| 7331503 | Solder printing process to reduce void formation in a microvia | Cheng Siew Tay, Swee Kian Cheng, Eng Hooi Yap | 2008-02-19 |