Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865491 | Devices for methodologies related to wafer carriers | Elena Becerra Woodard, Daniel Kwadwo Amponsah Berkoh, David J. Zapp, Hyong-yong Lee, Daniel Eduardo Sanchez +1 more | 2018-01-09 |
| 9833980 | Securing mechanism and method for wafer bonder | David J. Zapp | 2017-12-05 |
| 9799507 | Devices and methodologies to clean wafers with solvent | David J. Zapp | 2017-10-24 |
| 9576838 | Devices for methodologies related to wafer carriers | Elena Becerra Woodard, Daniel Kwadwo Amponsah Berkoh, David J. Zapp, Hyong-yong Lee, Daniel Eduardo Sanchez +1 more | 2017-02-21 |
| 9539801 | Debonders with a recess and a side wall opening for semiconductor fabrication | David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong-yong Lee | 2017-01-10 |
| 9533484 | Debonders with a recess and a heater for semiconductor fabrication | David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong-yong Lee | 2017-01-03 |
| 9412630 | Securing mechanism and method for wafer bonder | David J. Zapp | 2016-08-09 |
| 9296194 | Debonders and related devices and methods for semiconductor fabrication | David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong-yong Lee | 2016-03-29 |
| 8888085 | Devices and methodologies for handling wafers | David J. Zapp | 2014-11-18 |
| 8758552 | Debonders and related devices and methods for semiconductor fabrication | David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong-yong Lee | 2014-06-24 |
| 8758553 | Fixtures and methods for unbonding wafers by shear force | Jens Albrecht Riege, David J. Zapp | 2014-06-24 |
| 8640755 | Securing mechanism and method for wafer bonder | David J. Zapp | 2014-02-04 |