Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7926698 | Spot heat wirebonding | Norihiro Kawakami, Yoshikatsu Umeda | 2011-04-19 |
| 7677432 | Spot heat wirebonding | Norihiro Kawakami, Yoshikatsu Umeda | 2010-03-16 |
| 7404513 | Wire bonds having pressure-absorbing balls | Norihiro Kawakami | 2008-07-29 |
| 6768212 | Semiconductor packages and methods for manufacturing such semiconductor packages | Akira Karashima, Margaret Simmons-Matthews | 2004-07-27 |