Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243808 | Chip scale package (CSP) semiconductor device having thin substrate | Lin Lv, Long Wang, Jun Lu | 2025-03-04 |
| 11784141 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Madhur Bobde, Bo-Wei Chen | 2023-10-10 |
| 11495548 | Semiconductor package having thin substrate and method of making the same | Jun Lu, Long Wang, Madhur Bobde, Bo-Wei Chen | 2022-11-08 |
| 10663997 | Electronic device circuit board | — | 2020-05-26 |