Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424567 | Chip package and manufacturing method thereof | Hsin-Yi Chen, Ching Ting Peng, Ho-Yin Yiu | 2025-09-23 |
| 8502393 | Chip package and method for forming the same | Chao-Yen Lin, Wen-Chou Tsai, Ming-Hong Fang, Jen-Yen Wang, Chih-Hao Chen +1 more | 2013-08-06 |
| 8294275 | Chip package and method for forming the same | Chao-Yen Lin, Wen-Chou Tsai, Ming-Hong Fang, Jen-Yen Wang, Chih-Hao Chen +1 more | 2012-10-23 |