Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401277 | Substrate processing with reduced warpage and/or controlled strain | Yun Wang | 2016-07-26 |
| 7612372 | Method and system for laser thermal processing of semiconductor devices | Yun Wang | 2009-11-03 |
| 6844250 | Method and system for laser thermal processing of semiconductor devices | Yun Wang | 2005-01-18 |
| 6777329 | Method to form C54 TiSi2 for IC device fabrication | Ze Shen, Alex See, Lap Chan | 2004-08-17 |