SC

Shih-Hsing Chan

XI Xintec: 1 patents #71 of 118Top 65%
Overall (All Time): #2,981,729 of 4,157,543Top 75%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9230927 Method of fabricating wafer-level chip package Chuan-Jin Shiu, Tsang-Yu Liu, Chih-Wei Ho, Ching-Jui Chuang 2016-01-05