| 12051543 |
Mutilayer electronic component and method of manufacturing the same |
Gi Long Kim, Tae Gyeom Lee, Byung Rok Ahn, Kyoung Jin Cha, Jong Ho Lee |
2024-07-30 |
| 12002623 |
Multilayered electronic component |
Tae Gyeom Lee, Gi Long Kim, Byung Rok Ahn, Kyoung Jin Cha |
2024-06-04 |
| 12002627 |
Multilayer electronic component and method of manufacturing the same |
Tae Gyeom Lee, Gi Long Kim, Byung Rok Ahn, Kyoung Jin Cha |
2024-06-04 |
| 12002628 |
Multilayered electronic component and method of manufacturing the same |
Tae Gyeom Lee, Gi Long Kim, Byung Rok Ahn, Kyoung Jin Cha |
2024-06-04 |
| 11996244 |
Multilayer electronic component and method of manufacturing the same |
Gi Long Kim, Kyoung Jin Cha, Tae Gyeom Lee, Byung Rok Ahn, Jong Ho Lee |
2024-05-28 |
| 11990284 |
Multilayered electronic component |
Jong Ho Lee, Gi Long Kim, Tae Gyeom Lee, Byung Rok Ahn, Kyoung Jin Cha |
2024-05-21 |
| 11049659 |
Multilayer ceramic electronic component and method for manufacturing the same |
Kyoung Jin Cha, Seung Heui Lee, Beom Seock Oh, Kwang Sic Kim, Dong Hoon Kim +1 more |
2021-06-29 |
| 10770227 |
Capacitor and board having the same |
Jae Yeol Choi, Seung Heui Lee, Jong Ho Lee, Kyoung Jin Cha |
2020-09-08 |
| 8835302 |
Method of fabricating a package substrate |
Dong Gyu Lee, Dae-Young Lee, Tae Joon Chung, Jin Won Choi |
2014-09-16 |
| 8671564 |
Substrate for flip chip bonding and method of fabricating the same |
Hueng Jae Oh, Tae Joon Chung, Dong Gyu Lee, Jin Won Choi |
2014-03-18 |
| 8486760 |
Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same |
Tae Joon Chung, Jin Won Choi, Dong Gyu Lee, Hueng Jae Oh |
2013-07-16 |
| 8456003 |
Package substrate capable of controlling the degree of warpage |
Dong Gyu Lee, Dae-Young Lee, Tae Joon Chung, Jin Won Choi |
2013-06-04 |
