Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546821 | Opening in a multilayer polymeric dielectric layer without delamination | Licheng M. Han, Michael Andrew Serafin, Byron Lovell Williams, Salvatore Pavone | 2020-01-28 |
| 9502365 | Opening in a multilayer polymeric dielectric layer without delamination | Licheng M. Han, Michael Andrew Serafin, Byron Lovell Williams, Salvatore Pavone | 2016-11-22 |