| 12414480 |
MRAM bottom electrode contact with taper profile |
Ashim Dutta, Tianji Zhou, Chih-Chao Yang |
2025-09-09 |
| 12327770 |
Probe pad with built-in interconnect structure |
Ashim Dutta, Ruturaj Nandkumar Pujari, Chih-Chao Yang |
2025-06-10 |
| 11876047 |
Decoupled interconnect structures |
Ashim Dutta, Tianji Zhou, Chih-Chao Yang |
2024-01-16 |
| 11621294 |
Embedding MRAM device in advanced interconnects |
Ashim Dutta, Tianji Zhou, Chih-Chao Yang |
2023-04-04 |
| 11361987 |
Forming decoupled interconnects |
Ashim Dutta, Tianji Zhou, Chih-Chao Yang |
2022-06-14 |
| 11251368 |
Interconnect structures with selective capping layer |
Tianji Zhou, Ashim Dutta, Chih-Chao Yang |
2022-02-15 |
| 11244907 |
Metal surface preparation for increased alignment contrast |
Tianji Zhou, Dominik Metzler, Chih-Chao Yang, Theodorus E. Standaert |
2022-02-08 |
| 11239160 |
E-fuse with dielectric zipping |
Tianji Zhou, Ashim Dutta, Chih-Chao Yang |
2022-02-01 |
| 11227997 |
Planar resistive random-access memory (RRAM) device with a shared top electrode |
Ashim Dutta, Tianji Zhou, Chih-Chao Yang |
2022-01-18 |
| 11177213 |
Embedded small via anti-fuse device |
Chih-Chao Yang, Baozhen Li, Tianji Zhou, Ashim Dutta |
2021-11-16 |
