| 12368096 |
Microelectronic devices with through-substrate interconnects and associated methods of manufacturing |
Kyle K. Kirby, Kunal R. Parekh |
2025-07-22 |
| 11527436 |
Microelectronic devices with through-substrate interconnects and associated methods of manufacturing |
Kyle K. Kirby, Kunal R. Parekh |
2022-12-13 |
| 10978386 |
Microelectronic devices with through-silicon vias and associated methods of manufacturing |
Kyle K. Kirby, Kunal R. Parekh, Philip J. Ireland |
2021-04-13 |
| 10685878 |
Microelectronic devices with through-substrate interconnects and associated methods of manufacturing |
Kyle K. Kirby, Kunal R. Parekh |
2020-06-16 |
| 10600689 |
Vias and conductive routing layers in semiconductor substrates |
Kyle K. Kirby |
2020-03-24 |
| 9799562 |
Vias and conductive routing layers in semiconductor substrates |
Kyle K. Kirby |
2017-10-24 |
| 9343362 |
Microelectronic devices with through-silicon vias and associated methods of manufacturing |
Kyle K. Kirby, Kunal R. Parekh, Philip J. Ireland |
2016-05-17 |
| 8907457 |
Microelectronic devices with through-substrate interconnects and associated methods of manufacturing |
Kyle K. Kirby, Kunal R. Parekh |
2014-12-09 |
| 8753981 |
Microelectronic devices with through-silicon vias and associated methods of manufacturing |
Kyle K. Kirby, Kunal R. Parekh, Philip J. Ireland |
2014-06-17 |
