Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8362609 | Integrated circuit package and method of forming an integrated circuit package | Dong Wook Kim | 2013-01-29 |
| 8258013 | Integrated circuit assembly having vented heat-spreader | Kumar Nagarajan, Dong Wook Kim, Kong Woo LEE | 2012-09-04 |
| 6768329 | Structure and method of testing failed or returned die to determine failure location and type | Joel J. Orona, Daniel C. Nuez | 2004-07-27 |