Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10259976 | Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink | Yasuo Shimobe, Koji Makihara | 2019-04-16 |
| 9379051 | Semiconductor device | Yasuo Shimobe, Keiji Mitote | 2016-06-28 |
| 8754178 | Resin composition and semiconductor device produced using resin composition | Takashi Kawana, Naoya Kanamori | 2014-06-17 |
| 8722768 | Liquid resin composition and semiconductor device | Kouji Makihara | 2014-05-13 |
| 6861013 | Die-attaching paste and semiconductor device | Nobuki Tanaka, Hikaru Okubo, Kazuto Onami, Tomohiro Kagimoto | 2005-03-01 |