Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8853312 | Resin composition and semiconductor device produced by using the same | Nobuki Tanaka, Itaru Watanabe | 2014-10-07 |
| 8614270 | Resin composition and semiconductor device produced by using the same | Nobuki Tanaka, Itaru Watanabe | 2013-12-24 |
| 8217115 | Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package | Takeshi Masuda | 2012-07-10 |
| 8088308 | Resin composition and semiconductor device produced by using the same | Nobuki Tanaka, Itaru Watanabe | 2012-01-03 |
| 6861013 | Die-attaching paste and semiconductor device | Nobuki Tanaka, Ryuichi Murayama, Kazuto Onami, Tomohiro Kagimoto | 2005-03-01 |