Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10259976 | Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink | Ryuichi Murayama, Koji Makihara | 2019-04-16 |
| 9379051 | Semiconductor device | Ryuichi Murayama, Keiji Mitote | 2016-06-28 |
| 7250209 | Transparent composite composition | Sumio Shibahara, Hiromitsu Kuramoto | 2007-07-31 |