| 12319385 |
Process for establishing uniform liquid films on polar and non-polar substrates |
Leon G. Higley |
2025-06-03 |
| 8907222 |
Adjustable cover for conductors and insulators |
Mark Stransky, Keith A. Miller, Mark Burns, Bryan Casenhiser |
2014-12-09 |
| 8901428 |
Movably adjustable cover for conductors and insulators |
Keith A. Miller, Mark Stransky, Mark Burns, Randy Cloud, Thomas Martin Haic |
2014-12-02 |
| 8901429 |
Dimensionally adjustable cover for conductors and insulators |
Keith A. Miller, Mark Burns, Tom Haic, Randy Cloud |
2014-12-02 |
| 6476470 |
Integrated circuit packaging |
Burhan Ozmat |
2002-11-05 |
| 5805425 |
Microelectronic assemblies including Z-axis conductive films |
— |
1998-09-08 |
| 5756368 |
Integrated circuit packaging method and the package |
Burhan Ozmat |
1998-05-26 |
| 5754403 |
Constraining core for surface mount technology |
Burhan Ozmat, Aubrey I. Chapman |
1998-05-19 |
| 5740605 |
Bonded z-axis interface |
— |
1998-04-21 |
| 5574415 |
Method of fabricating microwave interconnects and packaging and the interconnects and packaging |
— |
1996-11-12 |
| 5571740 |
Method of making a capped modular microwave integrated circuit |
— |
1996-11-05 |
| 5376574 |
Capped modular microwave integrated circuit and method of making same |
— |
1994-12-27 |
| 4963697 |
Advanced polymers on metal printed wiring board |
Larry J. Mowatt, Aaron D. Poteet |
1990-10-16 |
| 4943468 |
Ceramic based substrate for electronic circuit system modules |
Robert Gordon, Brian Love, Burhan Ozmat |
1990-07-24 |
| 4882454 |
Thermal interface for a printed wiring board |
Larry J. Mowatt, Aaron D. Poteet |
1989-11-21 |
| 4776804 |
Circuit board systems, connectors used therein, and methods for making the connectors and systems |
Larry K. Johnson, Austin S. O'Malley, Robert M. Fife, Walter L. Walas, Larry J. Mowatt +1 more |
1988-10-11 |
| 4688150 |
High pin count chip carrier package |
— |
1987-08-18 |