Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10322210 | Preparation method of core-shell structured fibrous scaffolds | Hae-Won Kim | 2019-06-18 |
| 7456496 | Package design and method of manufacture for chip grid array | Tan Kim Hwee, Kee Kwang Lau, Alex Chew, Antonio B. Dimaano, Jr. | 2008-11-25 |
| 6929981 | Package design and method of manufacture for chip grid array | Tan Kim Hwee, Kee Kwang Lau, Alex Chew, Antonio B. Dimaano, Jr. | 2005-08-16 |
| 6750082 | Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip | John Briar, Tan Kim Hwee | 2004-06-15 |
| 6734039 | Semiconductor chip grid array package design and method of manufacture | Tan Kim Hwee, Kee Kwang Lau, Alex Chew, Antonio B. Dimaano, Jr. | 2004-05-11 |