| 8998384 |
Circuits and methods using a non-gold corrosion inhibitor |
Lynn Walsh, Mark Walsh, Soon Yeng Chan, Alejandro Aldrin A. Narag, II |
2015-04-07 |
| 7947429 |
Long length flexible circuits and method of making same |
— |
2011-05-24 |
| 7871150 |
Flexible circuits having ink-resistant covercoats |
Thach G. Truong |
2011-01-18 |
| 6489042 |
Photoimageable dielectric material for circuit protection |
Robert S. Clough |
2002-12-03 |
| 6098282 |
Laminar stackable circuit board structure with capacitor |
Jerome A. Frankeny, Richard F. Frankeny, Terry F. Hayden, Janet L. Rice |
2000-08-08 |
| 5745333 |
Laminar stackable circuit board structure with capacitor |
Jerome A. Frankeny, Richard F. Frankeny, Terry F. Hayden, Janet L. Rice |
1998-04-28 |
| 5509200 |
Method of making laminar stackable circuit board structure |
Jerome A. Frankeny, Richard F. Frankeny, Keith A. Vanderlee |
1996-04-23 |
| 5363275 |
Modular component computer system |
Jerome A. Frankeny, Richard F. Frankeny, Karl Hermann |
1994-11-08 |
| 5316787 |
Method for manufacturing electrically isolated polyimide coated vias in a flexible substrate |
Richard F. Frankeny |
1994-05-31 |
| 5229916 |
Chip edge interconnect overlay element |
Richard F. Frankeny |
1993-07-20 |
| 5198693 |
Aperture formation in aluminum circuit card for enhanced thermal dissipation |
Joseph LaTorre |
1993-03-30 |
| 5146674 |
Manufacturing process of a high density substrate design |
Richard F. Frankeny, Karl Hermann, Joseph LaTorre |
1992-09-15 |
| 5065227 |
Integrated circuit packaging using flexible substrate |
Jerome A. Frankeny, Richard F. Frankeny, Karl Hermann |
1991-11-12 |
| 5037311 |
High density interconnect strip |
Jerome A. Frankeny, Richard F. Frankeny, Javad Haj-Ali-Ahmadi, Karl Hermann |
1991-08-06 |
| 4943242 |
Zero insertion force high density connector system |
Richard F. Frankeny, Javad Haj-Ali-Ahmadi, Rolf Wustrau |
1990-07-24 |
