Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300567 | Solid metal foam thermal interface material | David P. Socha | 2025-05-13 |
| 11766721 | Thermally decomposing build plate for facile release of 3D printed objects | David P. Socha, James E. Hisert, Elizabeth Claire Hotvedt | 2023-09-26 |
| 10943795 | Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger | James E. Hisert, Robert N. Jarrett, Jordan Peter Ross | 2021-03-09 |
| 10943796 | Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger | James E. Hisert, Robert N. Jarrett, Jordan Peter Ross | 2021-03-09 |
| 10607857 | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger | James E. Hisert, Robert N. Jarrett, Jordan Peter Ross | 2020-03-31 |