Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943795 | Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger | Ross B. Berntson, James E. Hisert, Jordan Peter Ross | 2021-03-09 |
| 10943796 | Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger | Ross B. Berntson, James E. Hisert, Jordan Peter Ross | 2021-03-09 |
| 10838002 | Burn-in preform and method of making the same | Thomas R. Gross, Anthony D. Lanza, Jr., Craig K. Merritt | 2020-11-17 |
| 10607857 | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger | Ross B. Berntson, James E. Hisert, Jordan Peter Ross | 2020-03-31 |
| 9468136 | Low void solder joint for multiple reflow applications | Jordan Peter Ross, Amanda M. Hartnett | 2016-10-11 |
| 7593228 | Technique for forming a thermally conductive interface with patterned metal foil | Craig K. Merritt | 2009-09-22 |