Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943795 | Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger | Ross B. Berntson, James E. Hisert, Robert N. Jarrett | 2021-03-09 |
| 10943796 | Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger | Ross B. Berntson, James E. Hisert, Robert N. Jarrett | 2021-03-09 |
| 10607857 | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger | Ross B. Berntson, James E. Hisert, Robert N. Jarrett | 2020-03-31 |
| 9468136 | Low void solder joint for multiple reflow applications | Amanda M. Hartnett, Robert N. Jarrett | 2016-10-11 |
| 9010616 | Low void solder joint for multiple reflow applications | Amanda M. Hartnett | 2015-04-21 |