AH

Amanda M. Hartnett

IN Indium: 3 patents #13 of 38Top 35%
📍 Utica, NY: #28 of 165 inventorsTop 20%
🗺 New York: #38,318 of 115,490 inventorsTop 35%
Overall (All Time): #1,511,866 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9468136 Low void solder joint for multiple reflow applications Jordan Peter Ross, Robert N. Jarrett 2016-10-11
9010616 Low void solder joint for multiple reflow applications Jordan Peter Ross 2015-04-21
8061578 Solder preform Paul A. Socha 2011-11-22