Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12275846 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board | Jun YASUMOTO, Teppei WASHIO, Hiroharu Inoue | 2025-04-15 |
| 12122129 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Hiroharu Inoue, Yiqun Wang | 2024-10-22 |
| 11945910 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Hiroharu Inoue, Yiqun Wang | 2024-04-02 |
| 11407869 | Prepreg, metal-clad laminate and printed wiring board | Keiko Kashihara, Hiroharu Inoue | 2022-08-09 |
| 11234329 | Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board | Keiko Kashihara, Hiroharu Inoue | 2022-01-25 |