Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495580 | Multi-chip module including stacked power devices with metal clip | Marie Denison, Takahiko Kudoh, Satyendra Singh Chauhan | 2022-11-08 |
| 10840171 | Integrated circuit package including inward bent leads | Michael L. Meyers, Scott F. Eisenhart, Sreenivasan K. Koduri | 2020-11-17 |
| 10128219 | Multi-chip module including stacked power devices with metal clip | Marie Denison, Takahiko Kudoh, Satyendra Singh Chauhan | 2018-11-13 |
| 9378882 | Method of fabricating an electronic circuit | Steven Kummerl | 2016-06-28 |
| 9177945 | Packaged semiconductor device having multilevel leadframes configured as modules | — | 2015-11-03 |
| 8946880 | Packaged semiconductor device having multilevel leadframes configured as modules | — | 2015-02-03 |