Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5773884 | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | Frank E. Andros, James R. Bupp, Michael DiPietro | 1998-06-30 |
| 5633533 | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | Frank E. Andros, James R. Bupp, Michael DiPietro | 1997-05-27 |
| 5561323 | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | Frank E. Andros, James R. Bupp, Michael DiPietro | 1996-10-01 |
| 5519936 | Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto | Frank E. Andros, James R. Bupp, Michael DiPietro | 1996-05-28 |
| 4690833 | Providing circuit lines on a substrate | William A. Donson, James V. Ellerson, William Lafer, Keith A. Snyder | 1987-09-01 |