Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8337556 | Curable media for implantable medical device | Samuel M. Shaolian, George P. Teitelbaum, Thanh Van Nguyen, To V. Pham | 2012-12-25 |
| 6875212 | Curable media for implantable medical device | Samuel M. Shaolian, George P. Teitelbaum, Thanh Van Nguyen, To V. Pham | 2005-04-05 |
| 6410415 | Flip chip mounting technique | James E. Clayton, Koji Ito, Masanori Akita, Toshihiro Mori, Minoru Wada | 2002-06-25 |
| 6219911 | Flip chip mounting technique | Koji Ito, Masanori Akita, Toshihiro Mori | 2001-04-24 |
| 6189208 | Flip chip mounting technique | Koji Ito, Masanori Akita, Toshihiro Mori, Minoru Wada | 2001-02-20 |
| 6138348 | Method of forming electrically conductive polymer interconnects on electrical substrates | Frank W. Kulesza | 2000-10-31 |
| 5918364 | Method of forming electrically conductive polymer interconnects on electrical substrates | Frank W. Kulesza | 1999-07-06 |
| 5879761 | Method for forming electrically conductive polymer interconnects on electrical substrates | Frank W. Kulesza | 1999-03-09 |
| 5611140 | Method of forming electrically conductive polymer interconnects on electrical substrates | Frank W. Kulesza | 1997-03-18 |
| 5237130 | Flip chip technology using electrically conductive polymers and dielectrics | Frank W. Kulesza | 1993-08-17 |
| 5196371 | Flip chip bonding method using electrically conductive polymer bumps | Frank W. Kulesza | 1993-03-23 |
| 5074947 | Flip chip technology using electrically conductive polymers and dielectrics | Frank W. Kulesza | 1991-12-24 |