Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6138348 | Method of forming electrically conductive polymer interconnects on electrical substrates | Richard H. Estes | 2000-10-31 |
| 5918364 | Method of forming electrically conductive polymer interconnects on electrical substrates | Richard H. Estes | 1999-07-06 |
| 5879761 | Method for forming electrically conductive polymer interconnects on electrical substrates | Richard H. Estes | 1999-03-09 |
| 5611140 | Method of forming electrically conductive polymer interconnects on electrical substrates | Richard H. Estes | 1997-03-18 |
| 5237130 | Flip chip technology using electrically conductive polymers and dielectrics | Richard H. Estes | 1993-08-17 |
| 5196371 | Flip chip bonding method using electrically conductive polymer bumps | Richard H. Estes | 1993-03-23 |
| 5074947 | Flip chip technology using electrically conductive polymers and dielectrics | Richard H. Estes | 1991-12-24 |