JC

James E. Clayton

MT Microelectronics Assembly Technologies: 18 patents #1 of 2Top 50%
IM Immunolight: 10 patents #14 of 43Top 35%
CE Cleanvolt Energy: 5 patents #1 of 5Top 20%
WL Wang Laboratories: 3 patents #40 of 284Top 15%
DU Duke University: 2 patents #648 of 2,315Top 30%
PC Polymer Flip Chip: 1 patents #7 of 7Top 100%
TC Toray Engineering Co.: 1 patents #46 of 169Top 30%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
Overall (All Time): #64,832 of 4,157,543Top 2%
45
Patents All Time

Issued Patents All Time

Showing 25 most recent of 45 patents

Patent #TitleCo-InventorsDate
12142431 Use of organic and organometallic high dielectric constant material for improved energy storage devices and associated methods John James Felten, Zakaryae Fathi, Joseph H. Simmons 2024-11-12
11901331 Adhesive bonding composition and electronic components prepared from the same Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr. 2024-02-13
11476222 Adhesive bonding composition and electronic components prepared from the same Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr. 2022-10-18
11270973 Adhesive bonding composition and electronic components prepared from the same Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr. 2022-03-08
11139118 Electrodes and currents through the use of organic and organometallic high dielectric constant materials in energy storage devices and associated methods Zakaryae Fathi, John James Felten 2021-10-05
10748868 Adhesive bonding composition and electronic components prepared from the same Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr. 2020-08-18
10593642 Adhesive bonding composition and electronic components prepared from the same Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr. 2020-03-17
10283476 Adhesive bonding composition and electronic components prepared from the same Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr. 2019-05-07
10102978 Electrodes and currents through the use of organic and organometallic high dielectric constant materials in energy storage devices and associated methods Zakaryae Fathi, John James Felten 2018-10-16
10074627 Adhesive bonding composition and electronic components prepared from the same Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr. 2018-09-11
10026711 Adhesive bonding composition and wafer-to-wafer bonded assembly prepared from the same Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr. 2018-07-17
9767960 Use of organic and organometallic high dielectric constant material for improved energy storage devices and associated methods John James Felten, Zakaryae Fathi, Jospeh H. Simmons 2017-09-19
9746879 Rigid circuit board with flexibly attached module Zakaryae Fathi 2017-08-29
9649832 Adhesive bonding composition and method of use Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr., Ian Nicholas Stanton, Jennifer Ann Ayres +8 more 2017-05-16
9338895 Method for making an electrical circuit Zakaryae Fathi 2016-05-10
9023249 Adhesive bonding composition and method of use Zakaryae Fathi, Harold Walder, Frederic A. Bourke, Jr., Ian Nicholas Stanton, Jennifer Ann Ayres +8 more 2015-05-05
8929054 Use of organic and organometallic high dielectric constant material for improved energy storage devices and associated methods John James Felten, Zakaryae Fathi, Joseph H. Simmons 2015-01-06
8899994 Compression connector system Zakaryae Fathi 2014-12-02
8902606 Electronic interconnect system Zakaryae Fathi 2014-12-02
8834182 Pierced flexible circuit and compression joint Zakaryae Fathi 2014-09-16
8837141 Electronic module with heat spreading enclosure Zakaryae Fathi 2014-09-16
8817458 Flexible circuit board and connection system Zakaryae Fathi 2014-08-26
8692124 Electrical connector and method of making Zakaryae Fathi 2014-04-08
8559181 Thin multi-chip flex module Zakaryae Fathi 2013-10-15
8345431 Thin multi-chip flex module Zakaryae Fathi 2013-01-01