Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Chandrika Prasad, Roy Yu, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann +6 more | 2004-01-20 |
| 6281452 | Multi-level thin-film electronic packaging structure and related method | Chandrika Prasad, Roy Yu, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann +6 more | 2001-08-28 |