Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10555417 | Mainboard assembly including a package overlying a die directly attached to the mainboard | Damion Searls, Weston Roth, Margaret D. Ramirez, James Jackson, Charles A. Gealer | 2020-02-04 |
| 10251273 | Mainboard assembly including a package overlying a die directly attached to the mainboard | Damion Searls, Weston Roth, Margaret D. Ramirez, James Jackson, Charles A. Gealer | 2019-04-02 |
| 9500128 | Heat-exchange architecture built into the exhaust of a turbine engine | — | 2016-11-22 |
| 7317256 | Electronic packaging including die with through silicon via | Christina K. Williams | 2008-01-08 |