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Semiconductor device with frame having arms |
Jefferson Talledo |
2023-08-01 |
| 11688715 |
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame |
Rennier Rodriguez, Raymond Albert Narvadez, Michael Tabiera |
2023-06-27 |
| 11552007 |
Modified leadframe design with adhesive overflow recesses |
Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag |
2023-01-10 |
| 11152326 |
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame |
Rennier Rodriguez, Raymond Albert Narvadez, Michael Tabiera |
2021-10-19 |
| 11004776 |
Semiconductor device with frame having arms and related methods |
Jefferson Talledo |
2021-05-11 |
| 10957634 |
Modified leadframe design with adhesive overflow recesses |
Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag |
2021-03-23 |
| 10615104 |
Modified leadframe design with adhesive overflow recesses |
Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag |
2020-04-07 |
| 10109563 |
Modified leadframe design with adhesive overflow recesses |
Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag |
2018-10-23 |
| 9947612 |
Semiconductor device with frame having arms and related methods |
Jefferson Talledo |
2018-04-17 |
| 9258890 |
Support structure for stacked integrated circuit dies |
Frederick Ray Gomez, Emmanuel Angeles |
2016-02-09 |
| 7089984 |
Forming folded-stack packaged device using progressive folding tool |
Ruel Pieda, Alan P. De Ocampo |
2006-08-15 |