Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12164113 | Optical engine and AR device | Yangchun Deng, Wangni Zhao | 2024-12-10 |
| 12107053 | Shielding process for SIP packaging | Juncheng Guo, Dewen Tian | 2024-10-01 |
| 12074037 | Packaging method for circuit units comprising circuit baseplate | Haisheng Wang, Dewen Tian | 2024-08-27 |
| 12060503 | Adhesive and application thereof | Chen Jin, Yingdan Zhu, Songli Wei, Chenxi Zhang, Evgeny Avtomonov | 2024-08-13 |
| 12031920 | Method for detecting coverage rate of intermetallic compound | Dingguo Zhong, Dewen Tian | 2024-07-09 |
| 12002685 | Method for packaging chip | Baoguan Yin, Fei She, Dewen Tian | 2024-06-04 |
| 11882681 | Electromagnetic shielding structure and manufacturing method thereof, and electronic device | Kaiwei Wang, Dewen Tian | 2024-01-23 |
| 11516595 | Integrated structure of mems microphone and air pressure sensor and fabrication method thereof | Dexin Wang, Huabin Fang | 2022-11-29 |
| 11417463 | Method for manufacturing coil, coil and electronic device | Quanbo Zou, Zhe Wang, Debo Sun | 2022-08-16 |
| 11099467 | Micro laser diode projector and electronics apparatus | Zhe Wang, Quanbo Zou, Jialiang Yan, Yujing Lin, Xiaoyang Zhang | 2021-08-24 |
| 10349187 | Acoustic sensor integrated MEMS microphone structure and fabrication method thereof | Junkai Zhan, Mengjin Cai, Guanxun Qiu, Zonglin Zhou | 2019-07-09 |
| 10277968 | Microphone with dustproof through holes | Guanxun Qiu | 2019-04-30 |
| 10246323 | Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus | Mengjin Cai | 2019-04-02 |
| 10177055 | Packaging structure of integrated sensor | Luyu Duanmu, Junde Zhang | 2019-01-08 |
| 9108840 | MEMS microphone and method for packaging the same | Zhe Wang, Shengli Pang, Fanghui Gu | 2015-08-18 |
| 8121315 | Condenser microphone chip | Yongchun Tao, Shengli Pang, Tongqing Liu | 2012-02-21 |