Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7427807 | Chip heat dissipation structure and manufacturing method | Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Hsin-Lung Kuo, Bin-Wei Lee +1 more | 2008-09-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7427807 | Chip heat dissipation structure and manufacturing method | Ming-Hang Hwang, Yu-Chiang Cheng, Chao-Yi Chen, Hsin-Lung Kuo, Bin-Wei Lee +1 more | 2008-09-23 |