Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497691 | Methods of stacking semiconductor dies | Chanho Shin, Seunghwan KIM, Hwijo Jeong | 2019-12-03 |
| 9837360 | Wafer level packages and electronics system including the same | Hyeong-Seok Choi, Ki Jun SUNG, Jong Hoon Kim, Young Geun Yoo | 2017-12-05 |
| 8889481 | Semiconductor device and method for manufacturing the same | Jong Hoon Kim | 2014-11-18 |