Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4747017 | Surface mountable integrated circuit package equipped with sockets | Mark A. Koors | 1988-05-24 |
| 4706811 | Surface mount package for encapsulated tape automated bonding integrated circuit modules | James Jung, Mark A. Koors | 1987-11-17 |
| 4490902 | Lead frame for molded integrated circuit package | Charles T. Eytcheson, Harold L. Fields | 1985-01-01 |
| 4398235 | Vertical integrated circuit package integration | Phillip R. Motz, Eugene H. Sayers | 1983-08-09 |