Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12281236 | Waste-cloth-containing recovered fiber coating slurry and coating, and preparation method thereof | Xun You, Huayu Fang, Xingsheng Jiang, Thomas Waltherschmidt, Tianyuan Li +3 more | 2025-04-22 |
| 11292057 | Method for manufacturing thin-walled metal component by three- dimensional printing and hot gas bulging | Zhubin He, Yi Xu, Jiangkai Liang, Wei Du | 2022-04-05 |
| 11207732 | Integrated method for manufacturing high-temperature resistant thin-walled component by preforming by laying metal foil strip | Zhubin He, Jiangkai Liang, Yi Xu, Wei Du, Yanli Lin +3 more | 2021-12-28 |
| 10580679 | Method of transfer printing and articles manufactured therefrom | Qiangfei Xia | 2020-03-03 |
| 8724038 | Wraparound assembly for combination touch, handwriting and fingerprint sensor | Srinivasan K. Ganapathi, Nicholas Ian Buchan, Kurt Edward Petersen, Ravindra V. Shenoy, Ericson Cheng | 2014-05-13 |
| 7643305 | System and method of preventing damage to metal traces of flexible printed circuits | — | 2010-01-05 |
| 6452790 | Computer module device and method | William Chu, Tony Man | 2002-09-17 |
| 5901043 | Device and method for reducing thermal cycling in a semiconductor package | Hem Takiar | 1999-05-04 |
| 5504370 | Electronic system circuit package directly supporting components on isolated subsegments | Hem Takiar | 1996-04-02 |
| 5502289 | Stacked multi-chip modules and method of manufacturing | Hem Takiar | 1996-03-26 |
| 5495398 | Stacked multi-chip modules and method of manufacturing | Hem Takiar | 1996-02-27 |
| 5491360 | Electronic package for isolated circuits | — | 1996-02-13 |
| 5428245 | Lead frame including an inductor or other such magnetic component | Seth R. Sanders, Hem Takiar | 1995-06-27 |
| 5422435 | Stacked multi-chip modules and method of manufacturing | Hem Takiar, Luu Thanh Nguyen | 1995-06-06 |
| 5415331 | Method of placing a semiconductor with die collet having cavity wall recess | — | 1995-05-16 |
| 5348316 | Die collet with cavity wall recess | — | 1994-09-20 |
| 5339216 | Device and method for reducing thermal cycling in a semiconductor package | Hem Takiar | 1994-08-16 |