Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8852986 | Integrated circuit package system employing resilient member mold system technology | Heap Hoe Kuan, Seng Guan Chow | 2014-10-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8852986 | Integrated circuit package system employing resilient member mold system technology | Heap Hoe Kuan, Seng Guan Chow | 2014-10-07 |