Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9585240 | Advanced grounding scheme | Thomas R. Landon, Jr., Tarak A. Railkar | 2017-02-28 |
| 8908383 | Thermal via structures with surface features | Tarak A. Railkar | 2014-12-09 |
| 8487435 | Sheet-molded chip-scale package | Frank J. Juskey, Otto Berger | 2013-07-16 |