Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249547 | Method for using a test wafer by forming modified layer using a laser beam and observing damage after forming modified layer | Satoshi Kobayashi, Shunsuke Teranishi, Atsushi Ueki, Yuriko Sato, Yasuhiro Shimma | 2019-04-02 |
| 9034735 | Laser processing method for workpiece | Shigefumi Okada | 2015-05-19 |
| 7544587 | Wafer dividing method and wafer dividing apparatus | Yosuke Watanabe, Keiji Nomaru, Koichi Mitani, Taizo Kise, Kohei Matsumoto +2 more | 2009-06-09 |