Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039320 | Optimized circuit design layout for high performance ball grid array packages | William P. Stearns | 2011-10-18 |
| 7611981 | Optimized circuit design layout for high performance ball grid array packages | William P. Stearns | 2009-11-03 |
| 6477046 | Ball grid array package and method using enhanced power and ground distribution circuitry | William P. Stearns | 2002-11-05 |
| 6215184 | Optimized circuit design layout for high performance ball grid array packages | William P. Stearns | 2001-04-10 |
| 6160705 | Ball grid array package and method using enhanced power and ground distribution circuitry | William P. Stearns | 2000-12-12 |
| 6111315 | Semiconductor package with offset die pad | William P. Stearns, Hall E. Jarman | 2000-08-29 |
| 6084777 | Ball grid array package | Navinchandra Kalidas, Michael A. Lamson | 2000-07-04 |
| 5895967 | Ball grid array package having a deformable metal layer and method | William P. Stearns, Navinchandra Kalidas | 1999-04-20 |