Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056555 | Semiconductor device having 3D inductor and method of manufacturing the same | Cheng-Hung Shih, Yi-Cheng Chen, Shang-Jan Yang | 2021-07-06 |
| 10808331 | Electroplating system and pressure device thereof | Cheng-Hung Shih, Tsuo-Yun Chu, Xin-Wei Lo | 2020-10-20 |
| 10168582 | Chip package having a flexible substrate | Chun-Yang Su, Jhao-Shin Wang, Xin-Wei Lo | 2019-01-01 |