Chun-Yang Su — 1 Patent at Chipbond Technology

Chun-Yang Su has been granted 1 US patent while listed as an inventor at Chipbond Technology. All of these patents were granted in 2019. Chun-Yang Su ranks #2,406,284 of 4,157,543 US inventors in our database (top 57.9%). Patent records list Chun-Yang Su in Hsinchu, TW.

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Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
10168582	Chip package having a flexible substrate	Jhao-Shin Wang, Nian-Cih Yang, Xin-Wei Lo	2019-01-01

Chun-Yang Su — 1 Patent

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