Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10808331 | Electroplating system and pressure device thereof | Cheng-Hung Shih, Tsuo-Yun Chu, Nian-Cih Yang | 2020-10-20 |
| 10168582 | Chip package having a flexible substrate | Chun-Yang Su, Jhao-Shin Wang, Nian-Cih Yang | 2019-01-01 |