Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7329617 | Coating for enhancing adhesion of molding compound to semiconductor devices | Jianxiong Li, Chi Chuen Chaw, Deming Liu, Yiu Fai Kwan, Wai Chan | 2008-02-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7329617 | Coating for enhancing adhesion of molding compound to semiconductor devices | Jianxiong Li, Chi Chuen Chaw, Deming Liu, Yiu Fai Kwan, Wai Chan | 2008-02-12 |