Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7750450 | Stacked die package with stud spacers | Ying-Ren Lin, Chee-Key Chung | 2010-07-06 |
| 7378726 | Stacked packages with interconnecting pins | Lee Ho | 2008-05-27 |
| 7235870 | Microelectronic multi-chip module | Marcelino Ian Estinozo | 2007-06-26 |