Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5578660 | Epoxy resin composition | Hiroshi Fujita, Shigehisa Ueda, Takashi Aihara | 1996-11-26 |
| 5416138 | Epoxy resin composition | Hiroshi Yasuda | 1995-05-16 |
| 5001174 | Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin | Kenichi Yanagisawa, Hironori Ohsuga, Hiroshi Shimawaki | 1991-03-19 |