Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5001174 | Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin | Kenichi Yanagisawa, Naoki Mogi, Hironori Ohsuga | 1991-03-19 |