Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12071395 | Method for producing carbodiimide compound | Nobuyuki Matsumoto | 2024-08-27 |
| 12017977 | Method for producing carbodiimide compound | Nobuyuki Matsumoto | 2024-06-25 |
| 11926694 | Method for producing aqueous carbodiimide-containing liquid | Shunsuke Iizuka | 2024-03-12 |
| 11810295 | Dynamic image analysis apparatus, dynamic image analysis method, and storage medium | — | 2023-11-07 |
| 11690585 | Radiation image display apparatus and radiation imaging system | Takanori Ando, Yuuichi Nishijima, Ichirou Hamamoto | 2023-07-04 |
| 11685753 | Metal alkoxide, and aqueous resin crosslinking composition and aqueous resin composition which use same | Shinichi Nakashima | 2023-06-27 |
| 11591435 | Polycarbodiimide compound, production method therefor, and resin composition | Naoki Nishikawa, Nami Tsukamoto, Yoshihiro Yamazaki | 2023-02-28 |
| 11361433 | Image display control system, image display system, and image analysis device for dynamic medical imaging | Takanori Ando, Ichirou Hamamoto, Naoki Hayashi | 2022-06-14 |
| 11345776 | Carboxyl-group-containing aqueous resin composition and method for manufacturing polycarbodiimide compound | Kimiyo Banno | 2022-05-31 |
| 11179908 | Method of manufacturing gloves, glove, and emulsion composition for gloves | Norihide Enomoto, Taichi Ogawa, Nobuyuki Matsumoto | 2021-11-23 |
| 11138725 | Radiation image display apparatus and radiation imaging system | Takanori Ando, Yuuichi Nishijima, Ichirou Hamamoto | 2021-10-05 |
| 10628923 | Radiographic image capturing system, image processor, and image processing method | Tatsuya Takagi, Hiroaki Matsumoto | 2020-04-21 |
| 8853442 | Resin crosslinking agent | Saori KOTANI | 2014-10-07 |
| 8604154 | Carbodiimide compound, carbodiimide composition and aqueous coating composition | Ikuo Takahashi, Noriko Osuga | 2013-12-10 |
| 5143951 | Epoxy resin composition for semiconductor sealing | Ken Ohta, Wataru Kosaka | 1992-09-01 |
| 5001174 | Epoxy resin composition for semiconductor sealing employing triphenylmethane based novolac epoxy resin | Naoki Mogi, Hironori Ohsuga, Hiroshi Shimawaki | 1991-03-19 |